KennTherm 7185
Thermal Interface Material
KennTherm 7185 Thermal Grease is a non-silicone grease with very low thermal impedance and long-term stability
Product detailsNon silicone Thermal Conductive Grease
KennTherm G27
Thermal Interface Material
KennTherm G27 Thermal Gel is a non-silicone thermal gel with low thermal impedance and high-temperature reliability. Apply on CPU, SSD, power supply…etc. Recommend replacing thermal pads according to the automation and flexible gap application.
Request informationBack to materialsMaterial information & specifications
Technical documents- Item No. : KennTherm G27
- Porduct Name : Thermal Interface Material
Description :
KennTherm G27 Thermal Gel is a non-silicone thermal gel with low thermal impedance and high-temperature reliability. Apply on CPU, SSD, power supply…etc.
Recommend replacing thermal pads according to the automation and flexible gap application.
Recommend replacing thermal pads according to the automation and flexible gap application.
Feature :
- Non-silicone base
- Applicable on Automated dispenser
- Wide range of thickness application
- Great high-temperature reliability
Specification :
| Properties | Test Methods | Units | Typical value |
| Appearance | gray | ||
| Specific Gravity | ASTM D1475 | g/cm3 | 2.6 |
| Viscosity | Orifice 1.5mm 90psi | Cps | 30 |
| BLT | 40psi | um | 40@10psi 30@40psi |
| Thermal Conductivity | ASTM D5470 | W/m-K | 3 |
| Thermal Impedance | ASTM D5470 | K-cm2/W | 0.167@10psi 0.116@40psi |
| Dry-Out test | 240 Hours at 358K | Weight% | 0.1 |
| Dielectric Strength | ASTM D-149 | KV/mm | 0.3 |
| Low-molecular-weight siloxane content (D3~D20) | 85°C/3h | ppm | n.d. |
| Usage temperature | °C | -40~150 |
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