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KennTherm 7185 · Thermal Interface Material
Non silicone Thermal Conductive Grease

KennTherm 7185

Thermal Interface Material

KennTherm 7185 Thermal Grease is a non-silicone grease with very low thermal impedance and long-term stability. The specially formulated thermal Grease with appropriate viscosity and good consistency can be spread easily and evenly. It can storaged in room temperature. It can be applied to the base and mounting studs of transistors, diodes and silicon-contro

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Material information & specifications

Technical documents
  • Item No. : KennTherm 7185
  • Porduct Name : Thermal Interface Material

Description :

KennTherm 7185 Thermal Grease is a non-silicone grease with very low thermal impedance and long-term stability.
The specially formulated thermal Grease with appropriate viscosity and good consistency can be spread easily and evenly.
It can storaged in room temperature. It can be applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers.
It can also serve as an effective thermal interface material for many heat sink devices where efficient cooling is required.

Feature :

  1. Non-silicone base
  2. No migration
  3. Safe to use, Easy to clean and Easy to apply
  4. Low dry-out, Low thermal impedance

Specification :

Properties Test Methods Units Typical value
Appearance gray
Specific Gravity ASTM D1475 g/cm3 2.3
Viscosity BrookField CVE #7 12 rpm Cps 350000
BLT 40psi 8
Thermal Conductivity ASTM D5470 W/m-K 1.5
Thermal Impedance ASTM D5470 K-cm2/W 0.168
Dry-Out test 240 Hours at 358K Weight% 0.1
Dielectric Strength ASTM D-149 KV/mm 2
Low-molecular-weight siloxane content (D3~D20) 85°C/3h ppm n.d.
Usage temperature °C -40~125

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