KennTherm 7185
Thermal Interface Material
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KennTherm X11
Thermal Interface Material
KennTherm X11 Thermal Grease is a non-silicone grease with extremely low thermal impedance and long-term stability. It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.
Request informationBack to materialsMaterial information & specifications
Technical documents- Item No. : KennTherm X11
- Porduct Name : Thermal Interface Material
Description :
KennTherm X11 Thermal Grease is a non-silicone grease with extremely low thermal impedance and long-term stability.
It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.
It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.
Feature :
- Ultra low thermal impedance
- Excellent long-term stability
- Non-sillicone grades
- No special requirements for storage
- Easy to apply and less to use
- No "burn-in" time required
- Low dry-out
- Not electrically conductive
- Low Pump-out
Specification :
| Properties | Test Methods | Units | Typical value |
| Appearance | gray | ||
| Specific Gravity | ASTM D1475 | g/cm3 | 2.4 |
| Viscosity | BrookField CVE #7 12 | Cps | 1000k |
| BLT | 40psi | 10 | |
| Thermal Conductivity | ASTM D5470 | W/m-K | 3.5 |
| Thermal Impedance | ASTM D5470 | K-cm2/W | 0.035 |
| Dry-Out test | 240 Hours at 358K | Weight% | 0.1 |
| Dielectric Strength | ASTM D-149 | KV/mm | 0.7 |
| Low-molecular-weight siloxane content (D3~D20) | 85°C/3h | ppm | n.d. |
| Usage temperature | °C | -40~125 |
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