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KennTherm Z1 · Thermal Interface Material
Non silicone Thermal Conductive Grease

KennTherm Z1

Thermal Interface Material

Item No. : KennTherm Z1 Porduct Name : Thermal Interface Material Description : KennTherm Z1 Thermal Grease is a non-silicone grease with extremely low thermal impedance and long-term stability. It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required. Feature : Excellent pe

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Material information & specifications

Technical documents
  • Item No. : KennTherm Z1
  • Porduct Name : Thermal Interface Material

Description :

KennTherm Z1 Thermal Grease is a non-silicone grease with extremely low thermal impedance and long-term stability.
It serves as an effective thermal interface material for HEAT SINK devices where efficient cooling as well as long-term stability is required.

Feature :

  1. Excellent performance
  2. Excellent long-term stability
  3. Non-corrosive
  4. No special requirements for storage
  5. Easy to apply and less to use
  6. No "burn-in" time required
  7. Low dry-out
  8. High Temperature resistance
  9. Not electrically conductive

Specification :

Properties Test Methods Units Typical value
Appearance gray
Specific Gravity ASTM D1475 g/cm3 2.6
Viscosity BrookField CVE #7 12 rpm Cps 4000k
BLT 40psi 25
Thermal Conductivity ASTM D5470 W/m-K 5
Thermal Impedance ASTM D5470 K-cm2/W 0.058
Dry-Out test 240 Hours at 358K Weight% 0.1
Dielectric Strength ASTM D-149 KV/mm 0.3
Low-molecular-weight siloxane content (D3~D20) 85°C/3h ppm n.d.
Usage temperature °C -40~125

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