
Cover Tape
KennFilm 3000
It is sealed on the carrier tape to protect and deliver the components mounted on the PCB
Item No. : KennFilm 3000 Porduct Name : It is sealed on the carrier tape to protect and deliver the components mounted on the PCB Description : Feature : Material properties: Stable peeling force. High transparency. Antistatic ingredients will not transfer or contaminate package contents. Antistatic properties: Both sides are permanently antistatic and still
Request informationBack to materialsMaterial information & specifications
Technical documents- Item No. : KennFilm 3000
- Porduct Name : It is sealed on the carrier tape to protect and deliver the components mounted on the PCB
Description :
Feature :
Material properties:
- Stable peeling force.
- High transparency.
- Antistatic ingredients will not transfer or contaminate package contents.
- Both sides are permanently antistatic and still have antistatic properties under 12% RH environment.
- Comply with ANSI/ESD S541 E.7 specification (R<1011Ω).
- Comply with ANSI/ESD S20.20 2021 requirements.
- Comply with IEC 61340-5-3 electrostatic specification requirements.
- Solvent-free process.
- Antimony free.
- Reduce the VOCs emissions and produced by ECO Process.
Specification :
| Property | Test Methods | Units | KF3121 | KF3521 |
| Base Polymer | PO / PA | PO / PA | ||
| Thickness | Thickness gauge | um | 54±5 | 54±5 |
| Tensile Strength (MD) | ASTM D882 | Kg/cm2 | ≧350 | ≧350 |
| Elongation at Break (MD) | ASTM D882 | % | ≧300 | ≧300 |
| Haze | ASTM D-1003 | % | ≦20 | ≦20 |
| Transmission | ASTM D-1003 | % | ≧90 | ≧90 |
| Surface Resistance (Backing) | ESD STM11.13 | Ohm | ≦10E10 | ≦10E10 |
| Surface Resistance (Component Side) | ESD STM11.13 | Ohm | ≦9E9 | ≦9E9 |
| Peeling Electrostatic Potential | Kenner Method | Volt | 15 | 10 |
| Recommended Sealing Temperature | °C | 150-170 | 120-150 | |
| Recommended Sealed Carrier Tape | PS | PC |

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